EBB324 - PEMBUNGKUSAN ELEKTRONIK
(ELECTRONIC PACKAGING)
[ 3 Unit ]
*** Sumber data : SMUP
📖 Sinopsis Kursus / Course Synopsis ▼
Kursus ini memperkenalkan pembungkusan IC dan proses pemasangan PCB, meliputi bahan, langkah pembuatan, dan kaedah ujian. Pelajar mempelajari teknik analisis kebolehpercayaan dan kegagalan, bersama kualiti industri dan sistem kawalan proses statistik. Penekanan diberikan pada menghubungkan bahan, proses dan kebolehpercayaan untuk memastikan penyelesaian pembungkusan semikonduktor berprestasi tinggi.
This course introduces IC packaging and PCB assembly processes, covering materials, manufacturing steps, and testing methods. Students learn reliability and failure analysis techniques, alongside industrial quality and statistical process control systems. Emphasis is placed on linking materials, processes, and reliability to ensure high-performance semiconductor packaging solutions.
*** Sumber data : SPBPK
📋 Hasil Pembelajaran Kursus / Course Learning Outcomes (HPK / CLO) ▼
| HPK / CLO | Penerangan HPK / CLO Description | Kaedah Pengajaran / Teaching Method | Pemetaan / Mapping: PLO USM |
Pemetaan / Mapping: LT |
|---|---|---|---|---|
| CLO1 | Able to analyze problem in semiconductor package manufacturing processes using proper failure analysis method and data analytics | Kuliah | PLO2 | C4 |
| CLO2 | Able to develop solution for problems in semiconductor package using proper quality tools | Kuliah | PLO2 | C5 |
| CLO3 | Able to apply suitable failure analysis and quality tools to analyze and find solution for problems in semiconductor package processes | Kuliah | PLO2 | C4 |
*** Sumber data : SPBPK
📊 Penilaian / Assessment ▼
| Komponen Penilaian / Assessment Component | Peratusan / Percentage |
|---|---|
| Kerja Kursus / Course Work | 30% |
| Peperiksaan Akhir (PA) / Exam Work | 70% |
*** Sumber data : SMUP