The course is divided into 2 parts ; Material related which covers semiconductor fabrication technology, singulation and warpage, electronic packaging, chip and wafer interconnect, wafer testing and failure analysis related to wafer. The other is mechanical related which covers thermal management and thermal transfer, and wafer molding and underfilling.
- Lecturer: DR. MOHAMMAD HAFIFI HAFIZ BIN ISHAIK
- Lecturer: IR. DR. MOHAMAD RIDUWAN BIN RAMLI
- Lecturer: IR. DR. MOHD SYAKIRIN BIN RUSDI
- Lecturer: PROF. MADYA IR. TS. DR. PUNG SWEE YONG
- Lecturer: PROFESOR IR. DR. MOHD ZULKIFLY BIN ABDULLAH
- Lecturer: PROFESOR MADYA DR. KHATIJAH AISHA BINTI YAACOB
- Lecturer: PROFESOR MADYA DR. MOHAMAD AIZAT BIN ABAS
- Lecturer: PROFESOR MADYA TS. DR. MOHD SHARIZAL BIN ABDUL AZIZ
- Lecturer: TS. DR. MUHAMED ABDUL FATAH BIN MUHAMED MUKHTAR
Skill Level: Beginner